物理学报2024,Vol.73Issue(20) :198-203.DOI:10.7498/aps.73.20241129

塑性热电材料研究进展及展望

Research progress and prospects of plastic thermoelectric materials

徐波 田永君
物理学报2024,Vol.73Issue(20) :198-203.DOI:10.7498/aps.73.20241129

塑性热电材料研究进展及展望

Research progress and prospects of plastic thermoelectric materials

徐波 1田永君1
扫码查看

作者信息

  • 1. 燕山大学,亚稳材料制备技术与科学国家重点实验室,秦皇岛 066004
  • 折叠

摘要

近年来,以Ag2S为代表的塑性热电材料研究取得显著进展.该类材料因具有较低的滑移势垒和较高的解理能,表现出优异的室温塑性,并可通过固溶优化实现塑性和热电性能的协同提升.最新研究表明,Mg3Bi2基单晶材料在塑性变形能力和室温热电性能方面综合表现更佳.微观结构表征及理论计算分析揭示了位错滑移在Mg3Bi2单晶塑性变形过程中的关键作用,特别是多个滑移系表现出较低的滑移势垒.这些发现不仅深化了对塑性热电材料微观变形机制的理解,还为优化材料性能和开发新型柔性热电器件奠定了重要基础.未来将这些材料应用于实际器件仍面临热稳定性、化学稳定性和界面接触等挑战,这些问题的解决将推动塑性热电材料在柔性电子领域的应用.

Abstract

In recent years,significant progress has been made in the research of plastic thermoelectric materials,for example,Ag2S-based alloys.These materials exhibit excellent room-temperature plasticity due to their low slipping barrier energy and high cleavage energy,with synergistic enhancements in plasticity and thermoelectric properties achievable through alloying and doping strategies.The latest study on Mg3Bi2-based single crystals demonstrated superior performance in terms of plastic deformation capability and room-temperature thermoelectric properties.Microstructural characterization and theoretical calculation have revealed the crucial role of dislocation glide in the plastic deformation process of Mg3Bi2 single crystals,especially,the low slipping barrier energy observed in multiple slip systems.Importantly,the Te-doped single-crystalline Mg3Bi2 shows a power factor of~55 pW cm-1 K-2 and ZT of~0.65 at room temperature along the ab plane,which exceed those of the existing ductile thermoelectric materials.These findings not only deepen the understanding of microscopic deformation mechanisms in plastic thermoelectric materials but also establish an important foundation for optimizing material properties and developing novel flexible thermoelectric devices.Future applications of these materials in practical devices still face challenges in thermal stability,chemical stability,and interfacial contact.Addressing these issues will promote the application of plastic thermoelectric materials in the field of flexible electronics.

关键词

塑性热电材料/柔性热电器件/Ag2S/Mg3Bi2

Key words

plastic thermoelectric materials/flexible thermoelectric devices/Ag2S/Mg3Bi2

引用本文复制引用

出版年

2024
物理学报
中国物理学会,中国科学院物理研究所

物理学报

CSTPCDCSCD北大核心
影响因子:1.038
ISSN:1000-3290
参考文献量24
段落导航相关论文