Research Progress on the Influence of Magnetron Sputtering Process Parameters and Materials on the Properties of Copper Thin Films
The principles of magnetron sputtering technology and its advantages in the field of copper thin film deposition are briefly described.The effects of key process parameters such as sputtering time,sputtering power,substrate bias,sputtering air pressure and substrate temperature on the microstructure,surface morphology,uniformity,grain size,surface roughness,resistivity,sputtering rate,film growth preferred orientation and stress of magnetron sputtering copper thin films are reviewed.In addition,the effects of different substrate materials(different material types,different grain orientations and different roughness),different grain sizes and purity of targets on the properties of copper thin films are also introduced.The influence law and mechanism of single factor change on the properties of copper thin films are summarized,providing theoretical reference for the preparation of high-quality copper thin films.Finally,the future research and development direction of magnetron sputtering copper thin film are prospected.
magnetron sputteringcopper thin filmprocess parameterinfluence lawmechanism of action
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维普
