Research and Optimization of Internal Package Structure of Optocoupler with Secondary Plastic Sealing
In order to explore the effect of the internal package structure of the optocoupler on the device performance,the finite element simulation of the internal package structure of the optocoupler was carried out.Under the same external package size and structure,the junction temperature,thermal stress and thermal strain of three different internal package structures were simulated by heat conduction model.By analyzing the defects existing in the two classical designs of the output-end loader table structures,the convex optimization structure was proposed.The internal package structure can effectively increase the heat dissipation area,thereby improving the problem of packaging delamination between the internal chip and the lead frame of the optocoupler,and meeting the requirements of the new energy automobile industry for the high-voltage resistance performance of the device.A small amount samples of the optimized optocoupler was prepared and tested.And the current transfer ratio(CTR)and insulation voltage between input and output were compared among three structures.The experimental results are in agreement with the simulation results.It is proved that the dynamic range of insulation voltage and CTR can be effectively improved by using the convex optimization structure.
optocouplerpackage delaminationpackage structurefinite element simulationheat transfer analysis
万方数据
维普
