Influence of Processing Parameters on the Quality of Through Hole of HTCC Green Tape
Laser drilling is an important step in the high temperature co-fired ceramic(HTCC)multilayer substrate process.The experiment of through hole processing of alumina green tape was carried out by picosecond laser.The effects of different laser power,processing speed and repetition frequency on the morphology and size of the processed through holes were studied.The results show that the laser power has a significant influence on the diameter,roundness and taper of the green tape through hole.With the increase of the laser power,the inlet-hole diameter of the through hole gradually increases and the inlet-hole roundness becomes worse.When the laser power is 10 W,the taper of the through hole is the smallest,which is 0.008°.As the processing speed(100-500 mm/s)increases,the through hole diameter decreases,and the through-hole diameter decreases by about 0.005 mm for every 100 mm/s increase in the processing speed.The processing speed has little influence on the roundness and taper of the through hole.The repetition frequency(600-1 000 kHz)has little influence on the diameter,roundness and taper of the through hole.By selecting appropriate laser power(10-15 W)and processing speeds(200-400 mm/s),high-quality through holes can be obtained.
alumina green tapepicosecond laserlaser drillinglaser powerprocessing speedthrough hole size
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