Research progress on applications of wafer micro-bump technology in advanced packaging
Advanced packaging technologies are getting more and more connection-dense,stacking-diversified,and functionally systematized.A variety of packaging processes have been developed,such as fan-out,2.5D/3D,and system-in-package.Wafer micro-bumps one of the most important technologies,has been widely used in various advanced packaging processes.In this paper,the main techniques of micro-bump preparation are introduced,and the advantages and disadvantages are compared.At the same time,two different micro-bump structures,namely,tin ball bump and copper pillar bump,are discussed to provide a reference for more in-depth research on micro-bumps.Finally,the applications of micro-bumps in advanced packaging are summarized in this paper,and the tendency of development in the near future is predicated.
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