Research progress in warping simulation and control of fan-out wafer-level packaging
This paper introduces the causes of warping during wafer reconstruction in the fan-out wafer-level packaging process briefly,and summarizes the research progress of warping simulation and control both at home and abroad in recent years.The causes of warping are introduced from the simulation analysis results of the materials used in the wafer reconstruction technique,the designed reconstruction structure,and the molding curing,thinning,debonding processes involved in the reconstruction.In addition,the simulation analysis capabilities of wafer reconstruction are compared with experimental results.Finally,this paper prospects the future development direction of reconstructed wafer warping correction.
fan-out wafer-level packagingwafer reconstructionwarping correctionfinite element analysis
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