Three-dimensional integrated circuit test method based on inductive coupled interconnection
Inductive coupled interconnect is a wireless technology used for interconnecting three-dimensional chip stack packages.It provides high-bandwidth communication between chips with greater flexibility and lower cost than TSV(through silicon via)technology.However,in multi-chip stacked systems that use inductive coupled interconnection,functional testing of the chips is more difficult due to the absence of physical connections.To ensure the correct and stable signal transmission,it is necessary to test the quality of the signal transmission.This paper proposes a test method for 3D chip systems on inductive coupled interconnection,including on-chip self-test,chip-level self-ordering,inter-chip mutual test,and auto-tuning of the transmission power of inductivel coupling.This method aims to improve the measurability and visibility of the wireless 3D chip,reduce the 3D chip test cost,and improve the test efficiency.
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