随着器件沟道尺寸的减小,为了获得更好的性能参数,器件工艺窗口变得越来越窄.与此同时,单MOSFET(metal oxide semiconductor field effect transistor)封装缺少静电保护电路.对于敏感器件的封装,异常的电气参数时有出现.通过使用FMEA(failure mode and effects analysts)和DOE(design of experiments)等质量工具,确认该问题与封装键合顺序和黏合剂有关.通过调整键合顺序和更换所使用的黏合剂,有效地解决了敏感器件封装低良的问题.该案例为同行业提供了借鉴.
A case study on the packaging yield improvement of sensitive devices
With the reduction of devices channel size and for getting better performance parameters,the process window has become increasingly narrow.At the same time,individual MOSFET packaging lacks electrostatic protection.For packaging the sensitive devices,abnormal electrical parameters occurred frequently after packaging.By using quality tools such as FMEA and DOE,it was confirmed that the issue is related to the packaging bonding sequence and adhesive.By adjusting the bonding sequence and replacing the adhesive,the issue of low yield in packaging sensitive devices has been effectively solved.The case provides reference for the same industry.
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