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ISSCC 2024论文技术热点分析

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随着新一轮科技革命和产业变革的加速演进,特别是 5G、人工智能、物联网、虚拟现实/增强现实和高性能计算等技术的快速发展,集成电路产业已成为全球技术竞争的焦点.作为集成电路设计领域的顶级国际会议,国际固态电路会议(ISSCC)汇聚了全球最前沿的技术成果.本文对近 5 年ISSCC中国内地和港澳地区论文接收情况进行梳理,并对 2024 年研究成果进行深入分析,涵盖作者背景、研究机构、基金支持、合作情况以及研究趋势等.此外,对这些论文的核心内容进行了翻译和整理,旨在为国内集成电路领域的研究人员提供最新的技术洞察,进而激发创新思维,推动产业进步.
Analysis of technical hotspots in ISSCC 2024 papers
With the accelerated evolution of a new wave of scientific and technological revolutions and industrial transformations—particularly the rapid advancements in 5G,artificial intelligence,the internet of things,virtual reality/augmented reality,and high-performance computing—the integrated circuit industry has emerged as a focal point in global technological competition.As the premier international conference in the field of integrated circuit design,the International Solid-State Circuits Conference(ISSCC)showcases the world's most cutting-edge technological achievements.This article reviews the acceptance of ISSCC papers from Chinese inland,Hong Kong,and Macao over the past five years and conducts an in-depth analysis of the research outcomes for 2024.It covers various aspects,including author backgrounds,research institutions,funding support,collaboration dynamics,and research trends.Additionally,this article translates and organizes the core content of these papers,aiming to provide the latest technical insights for domestic researchers in the field of integrated circuits,thereby inspiring innovative thinking and promoting industrial advancement.

ISSCCintegrated circuitresearch trendtechnology insight

杨业成、王少昊

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福州大学-晋江微电子研究院 晋江 362200

ISSCC 集成电路 研究趋势 技术洞察

2024

微纳电子与智能制造

微纳电子与智能制造

ISSN:
年,卷(期):2024.6(2)