Microminiaturization and integration technology of electronic components
Traditional miniaturization and integration methods for electronic components rely on manufacturing processes such as photolithography and etching.However,these processes have limitations in achieving smaller dimensions and higher integration,leading to a decrease in GDS indicators.Therefore,a new method for miniaturization and integration of electronic components has been proposed.Firstly,based on fusion theory,electronic components are fused.Then,the fusion results of electronic components are used to map the structure of electronic components.Finally,based on the mapping results,semantic constraints for electronic component integration are designed to generate the electronic component integration ontology,thereby achieving miniaturization and integration of electronic components.The experimental results indicate that the GDS index of this method shows a significant and sustained growth trend,with positive impact and potential value.
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