The rapid development of manufacturing technology has made it possible for semiconductor industry to enter the era of Very Deep Sub-Micron. TSV technology based 3D IC overcome the difficulties of over-long interconnect between each components of IC, therefore becoming an emerging and competitive technique and gains popularity among researchers and developers in related work of line. Overviews the new characteristics of testing and for TSV centered 3D IC, introduces the advantages of 3D IC, and expounds various challenging problems confronted by researchers. Analyses the testing methods suitable for 3D IC and the challenges that must be tackled by the researchers are elaborated in detail.
3D ICTestFormal VerificationVDSM(Very Deep Sub-Micron)TSV
NETL
NSTL
万方数据
维普
