现代科学仪器2024,Vol.41Issue(6) :169-173.

后牙区种植单冠全数字化流程修复效果及并发症影响因素

The effect of full digital process restoration of implant single crown in posterior tooth area and the influencing factors of complications

王志霞 刘月 高文冰
现代科学仪器2024,Vol.41Issue(6) :169-173.

后牙区种植单冠全数字化流程修复效果及并发症影响因素

The effect of full digital process restoration of implant single crown in posterior tooth area and the influencing factors of complications

王志霞 1刘月 1高文冰1
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作者信息

  • 1. 大庆市第四医院口腔科,大庆 163000
  • 折叠

摘要

目的:探寻后牙区种植单冠全数字化流程修复效果及并发症影响因素.方法:选取后牙区种植体单冠修复患者 168例,随机分为试验组(全数字化流程修复)和对照组(常规修复).对比两组种植成功率,2年存留率以及并发症情况.分析影响发生并发症的因素.结果:相较于对照组,试验组有更高的种植成功率、2年内存留率,以及更低的并发症总发生率(P<0.05).牙周炎史、不良咬合习惯、种植体长度≥10mm为影响发生并发症独立危险因素,全数字化流程修复为保护因素.结论:后牙区种植单冠全数字化流程修复效果确切.临床可根据并发症影响因素给予针对性干预,降低发生率.

Abstract

Objective:To explore the effect of full digital process restoration of implant single crown in the posterior area and the influencing factors of complications.Methods:168 patients with implant crown restoration in the posterior area were randomly divided into experimental group(full digital process restoration)and control group(conventional restoration).The success rate,2-year survival rate and complications of the two groups were compared.The factors influencing the occurrence of complications were analyzed.Results:Compared with the control group,the experimental group had higher implantation success rate,2-year retention rate and lower total incidence of complications(P<0.05).Periodontitis history,bad occlusal habits and implant length≥10mm were independent risk factors for complications,and full digital process restoration was the protective factor.Conclusions:The full digital process of dental implant crown restoration in the posterior area is effective.Clinical intervention can be given according to the influencing factors of complications to reduce the incidence.

关键词

后牙区种植单冠/全数字化流程修复/并发症/影响因素

Key words

posterior implant-supported single crown/Full digital process repair/Complications/Influencing factors

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出版年

2024
现代科学仪器
中国分析测试协会

现代科学仪器

CSTPCD
影响因子:0.329
ISSN:1003-8892
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