Design and Preparation of Cooling Disc Based on Semiconductor Wafer Cooling Process
Wafer is a kind of silicon wafer used in the production of silicon semiconductor Integrated Circuit,is the basic material for the production of semiconductor chips,in the semiconductor Integrated Circuit Chip(IC)industry has an important position,so the wafer production process requirements are extremely high.Based on the cooling process of wafer,a cooling disc is designed and prepared.Firstly,through analysis,stainless steel+nickel plated copper is selected as the production material of the cooling disc body.Secondly,the structure,thickness and manufacturing process of the cooling disc are analyzed,and the design innovation points are obtained.Finally,the actual application results show that the cooling rate of the cooling disc can reach 2.68℃·s-1,and there is no deformation and copper ion leakage during the cooling process,and there is no water leakage and gas leakage.
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NSTL
万方数据
维普
