颗粒金属有压烧结工艺的压力加载装置设计
Design of Pressure Loading Device for Pressures-Sintering Process of Granular Metal
杨雯 1刘梦豪 1蔡苗1
作者信息
- 1. 桂林电子科技大学 机电工程学院,桂林 541004
- 折叠
摘要
文章设计一种应用于颗粒金属有压烧结工艺的压力加载装置,该装置可以稳定、批量加压.建立有限元模型,仿真分析装置对多个芯片同时加载时的压力加载效果.结果表明,装置对同一批次芯片加载的应力控制良好,能够开展多芯片同时烧结,可以满足有压烧结工艺中的多芯片批量烧结的要求.
Abstract
In this paper,a kind of pressure loading device is designed,which can be applied to the pressure sintering process of granular metal.A finite element model is established to simulate and analyze the pressure loading effect of the device when multiple chips are loaded simultaneously.The results show that the device can control the stress of the same batch of chips well,and can carry out the simultaneous sintering of multiple chips,which can meet the requirements of multi-chip batch sintering in the pressure sintering process.
关键词
颗粒金属/有压烧结/压力加载/芯片Key words
granular metal/pressure sintering/pressure loading/chip引用本文复制引用
基金项目
广西自然科学基金面上项目(2023GXNSFAA026188)
出版年
2024
NETL
NSTL
万方数据