激光切割SiC/Al复合材料的温度场仿真分析
Simulation Analysis of Temperature Fields of Laser-Cut SiC/Al Composites
李廷余 1吕国敏 2王侃3
作者信息
- 1. 山东欣怡翔精密机械制造有限公司,济宁 273201
- 2. 中国水利水电科学研究院,北京 100038
- 3. 山东大学 机电与信息工程学院,威海 264209
- 折叠
摘要
SiC/Al复合材料具有较高的强度、较低的热膨胀系数和较好的耐腐蚀性,使其在多个高技术领域中具有很大的应用潜力和价值.然而,由于SiC/Al复合材料的高硬度特性,使用传统切削技术对其进行加工时,刀具磨损严重,影响加工效率.而激光切割技术在SiC/Al复合材料加工方面具有显著优势.文章利用有限元分析软件对SiC/Al复合材料进行仿真分析,了解材料特性和激光切割去除机理,探究加热时间、光斑尺寸等对材料表面温度场的影响.
Abstract
SiC/Al composites have high strength,low thermal expansion coefficient and good corrosion resistance,which makes them have great application potential and value in many high-tech fields.However,due to the high hardness characteristics of SiC/Al composite materials,the tool wear is serious when it is processed with traditional cutting technology,which affects the processing efficiency.Laser cutting technology has significant advantages in the processing of SiC/Al composite materials.In this paper,finite element analysis software is used to simulate SiC/Al composites,understand the material characteristics and laser cutting removal mechanism,and explore the effects of heating time and spot size on the material surface temperature field.
关键词
SiC/Al复合材料/激光加工/温度场/有限元分析Key words
SiC/Al composites/laser processing/temperature field/finite element analysis引用本文复制引用
基金项目
山东省科技型中小企业创新能力提升工程项目(2023TSGC0305)
出版年
2024
NETL
NSTL
万方数据