电子封装中表面贴装锡基焊点机械强度检测研究
Study on Mechanical Strength Detection of Tin-Based Solder Joints in Surface Mounting in Electronic Packaging
周宝强1
作者信息
- 1. 青岛海信移动通信技术有限公司,青岛 266000
- 折叠
摘要
针对现行方法在电子封装中表面贴装锡基焊点机械强度检测中应用存在误差较大的问题,提出电子封装中表面贴装锡基焊点机械强度检测研究.利用电荷耦合器件(Charge-Coupled Device,CCD)摄像机获取锡基焊点图像,并对焊点图像二值化,提取焊点轮廓,采用平均法增强图像,利用灰度共生矩阵提取焊点纹理特征,综合焊点表面高斯曲率、平均曲率、总曲率及倾角,实现电子封装中表面贴装锡基焊点机械强度检测.实验证明,设计的方法均方根误差不超过0.1,平均绝对误差不超过2%,具有较高的检测精度.
Abstract
In view of the application of the current method in the mechanical strength detection of tin based solder joints in electronic packaging,the study on the mechanical strength detection of tin based solder joints in electronic packaging is proposed.Using Charge-Coupled Device(CCD)camera to obtain tin-based solder joint image,and solder joint image binarization,extract the solder joint contour,averaging the image,using the gray symbiotic matrix,comprehensive Gaussian curvature,average curvature,total curvature,inclination,realize the mechanical strength detection of tin-based solder joint surface mounting in electronic packaging.It has been proved that the design method has a root mean square error of less than 0.1 and a mean absolute error of less than 2%,with high detection accuracy.
关键词
电子封装/表面贴装/锡基焊点/机械强度/检测/灰度共生矩阵Key words
electronic packaging/surface mounting/tin-based solder joints/mechanical strength/detection/grayscale symbiosis matrix引用本文复制引用
出版年
2024
NETL
NSTL
万方数据