Electroless Copper Plating on Alumina Ceramic Substrate by Cobalt Ativation Method and Its Electromagnetic Shielding Properties
In order to reduce the use of precious metal ions in the pre-treatment process of electroless cop-per plating,this paper proposes a cobalt activation method for pre-treatment of electroless copper plating.Cobalt particles with catalytic activity were prepared on the surface of alumina ceramic substrate using co-balt sulfate as the cobalt source and potassium borohydride as the reducing agent,followed by chemical copper plating.The cobalt activation process was optimized by orthogonal test,the surface morphology of the plating layer was observed by scanning electron microscope,the physical phase composition and grain state of the plating layer were analyzed by energy spectrometer and X-ray diffraction analyzer,and the bonding,solderability and electromagnetic shielding properties of the plating layer were tested by adhesive tape method,immersion tin method,and vector network analyzer,respectively.The results show that when the cobalt sulfate is 35 g/L,the concentration of potassium borohydride is 3.6 g/L,the preactivation temperature is 30 ℃,and the activation time is 5 min,the resulting plated layer has uniform morphology,good solderability,and bonding,and the average electromagnetic shielding efficiency can reach 86.6 dB.This process has good environmental friendliness while ensuring the performance of the coating.
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