基于二硫键的自修复可拆解环氧类玻璃高分子在电子封装中的应用

Application of Self-healing and Detachable Epoxy Vitrimer Polymer Based on Disulfide Bond in Electronic Packaging

陈瑞琪 ¹朱露 ¹周林访 ¹周琳 ¹陈茂²

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作者信息

1. 西南科技大学环境友好能源材料国家重点实验室四川绵阳 621010
2. 中国工程物理研究院化工材料研究所四川绵阳 621900
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摘要

为了实现环氧封装的电子器件无损修复和回收,在中低温(60 ℃)条件下制备了含有动态二硫键的环氧类玻璃体高分子(TESS)并将其用于电子封装.TESS表现出优异的尺寸稳定性、良好的力学性能(力学强度为(2.5±0.3)MPa,断裂伸长率为24％±7％)和良好的热稳定性(最大分解温度为255℃).通过TESS网络中的二硫交换反应,实现了 TESS封装的电路板裂纹在80 ℃中等温度下1 h的完全愈合及TESS封装的LED灯的无损回收.采用TESS封装电子器件为处理不合格的电子产品和退役电子产品提供了更好的方法,可实现资源回收利用.

Abstract

In order to realize non-destructive repair and recycling of epoxy-encapsulated electronic devices,epoxy vitrimer polymer based on disulfide bond(TESS)was prepared at low and medium temperatures(60℃)and applied to electronic encapsulation.TESS shows excellent dimensional stability,good mechanical properties with a mechanical strength of(2.5±0.3)MPa and an elongation at break of 24％±7％,and good thermal stability with a maximum decomposition temperature of 255℃.Through the disulfide exchange reaction in the TESS network,the cracks of the TESS-encapsulated circuit boards can be completely healed at a medium temperature of 80℃ for 1 h,and the lossless recycling of the TESS-encapsulated LED lamps has been realized.The TESS-encapsulated electronic device provides a better way to deal with substandard and decommissioned electronic products,and can achieve resource recycling.

关键词

环氧类玻璃体高分子/中低温固化/电子器件/无损回收

Key words

Epoxy vitrimer polymer/Curing at low-medium temperature/Electric equipment/Non-destructive recycling

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出版年

2024

西南科技大学学报

西南科技大学

西南科技大学学报

影响因子：0.348

ISSN：1671-8755

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