Application of Self-healing and Detachable Epoxy Vitrimer Polymer Based on Disulfide Bond in Electronic Packaging
In order to realize non-destructive repair and recycling of epoxy-encapsulated electronic devices,epoxy vitrimer polymer based on disulfide bond(TESS)was prepared at low and medium temperatures(60℃)and applied to electronic encapsulation.TESS shows excellent dimensional stability,good mechanical properties with a mechanical strength of(2.5±0.3)MPa and an elongation at break of 24％±7％,and good thermal stability with a maximum decomposition temperature of 255℃.Through the disulfide exchange reaction in the TESS network,the cracks of the TESS-encapsulated circuit boards can be completely healed at a medium temperature of 80℃ for 1 h,and the lossless recycling of the TESS-encapsulated LED lamps has been realized.The TESS-encapsulated electronic device provides a better way to deal with substandard and decommissioned electronic products,and can achieve resource recycling.
Epoxy vitrimer polymerCuring at low-medium temperatureElectric equipmentNon-destructive recycling
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维普
