首页|Exploring the effect of fingertip aero-haptic feedforward cues in directing eyes-free target acquisition in VR

Exploring the effect of fingertip aero-haptic feedforward cues in directing eyes-free target acquisition in VR

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Background The sense of touch plays a crucial role in interactive behavior within virtual spaces,particularly when visual attention is absent.Although haptic feedback has been widely used to compensate for the lack of visual cues,the use of tactile information as a predictive feedforward cue to guide hand movements remains unexplored and lacks theoretical understanding.Methods This study introduces a fingertip aero-haptic rendering method to investigate its effectiveness in directing hand movements during eyes-free spatial interactions.The wearable device incorporates a multichannel micro-airflow chamber to deliver adjustable tactile effects on the fingertips.Results The first study verified that tactile directional feedforward cues significantly improve user capabilities in eyes-free target acquisition and that users rely heavily on haptic indications rather than spatial memory to control their hands.A subsequent study examined the impact of enriched tactile feedforward cues on assisting users in determining precise target positions during eyes-free interactions,and assessed the required learning efforts.Conclusions The haptic feedforward effect holds great practical promise in eyeless design for virtual reality.We aim to integrate cognitive models and tactile feedforward cues in the future,and apply richer tactile feedforward information to alleviate users'perceptual deficiencies.

HapticFeedforwardVirtual realityAero-haptic

Xiaofei REN、Jian HE、Teng HAN、Songxian LIU、Mengfei LV、Rui ZHOU

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Faculty of Information Technology,Beijing University of Technology,Beijing 100124,China

Beijing Engineering Research Center for IoT Software and Systems,Beijing University of Technology,Beijing 100124,China

Institute of Software Chinese Academy of Sciences,Beijing 100190,China

2024

虚拟现实与智能硬件(中英文)

虚拟现实与智能硬件(中英文)

ISSN:
年,卷(期):2024.6(2)