Study on Element Segregation and Grain Distribution Characteristics of Aluminum and Copper Wire Melting Marks
Through electron microprobe element analysis and electron backscatter diffraction analysis,a study was conducted on the micro-area element segregation and grain distribution morphology of aluminum and copper wire melting marks caused by fire and short circuits.The results showed significant iron element segregation in both fire-induced and short-circuit-induced melting marks of aluminum wires,but with different distribution patterns:iron elements formed coarse ring-like structures in fire-induced marks,while they appeared as elongated chain-like structures in short-circuit-induced marks.For copper wires,both fire-induced and short-circuit-induced melting marks exhibited oxygen element segregation,with distinct oxide morphologies:oxides in fire-induced marks were concentrated and mainly appeared as elongated rod-like or point-like structures,whereas in short-circuit-induced marks,they were dispersed and mainly spread in a network-like pattern.Additionally,there were notable differences in grain distribution and orientation between fire-induced and short-circuit-induced melting marks of both aluminum and copper wires.Fire-induced marks were dominated by coarse equiaxed grains or dendrite-like structures,while short-circuit-induced marks were mainly characterized by coarse columnar grains.It is worth noting that grain growth in short-circuit-induced marks exhibited a clear preferential orientation,whereas no such preference was observed in fire-induced marks.
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维普
