Thermal conductivity enhancement of alumina-filled thermal conductive gel
To alleviate the heat dissipation pressure of components caused by high integration of electronic devices,an alumina-filled gel with high thermal conductivity and low oil penetration was prepared in this work.Specifically,the effects of filler compounding,surface modification and filler content on thermal con-ductivity and oil penetration were investigated.The results show that the appropriate size of the filler for thermal conductive gels filled with single-particulate alumina is 20 μm.The thermal conductivity of the gel filled with 60％(volume fraction)of alumina was 2.08 W·m-1·K-1,when the alumina particles of 3 μm and 20 μm were graded with the mass ratio of 1∶7.Moreover,the thermal conductivity of the gel filled with the alumina modified by silane coupling agent(2.65 W·m-1·K-1)was increased by 27.2％.Our data indicated that the increase of oxygen atoms on the surface of alumina is crucial in enhancing the ther-mal conductivity of the gel.The thermal conductivity of the gel varies with filler content,increasing initially and then decreasing.While,the oil penetration rate of the gel decreases as the filling volume increases.The percolation threshold of alumina is 60％.
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