Analysis of chip thermal performance under different cooling fin structures
In order to alleviate the problem of heat dissipation in hot spots,based on a hybrid heat sink com-bining microchannel and pin-fin heat sink,three kinds of micro channel heat sinks with different cross-sec-tional shapes and fins were proposed,and the computational fluid dynamics method was used to carry out related research,the temperature field and flow field distribution characteristics of the background and hot spot areas of the three micro channel heat sinks were analyzed,and the peak temperature,temperature difference,voltage drop and equivalent thermal resistance of the heat sink were selected as performance pa-rameters to evaluate the heat dissipation performance of the three heat sinks.The results show that under the four coolant inlet flow velocities(0.2 m·s-1,0.4 m·s-1,0.6 m·s-1,0.8 m·s-1),the micro-channel radiators with cylindrical fins show the lowest peak temperature,the smallest temperature difference and the lowest equivalent thermal resistance.Taking the inlet coolant flow rate as an example,the maximum temperature of the heat source surface of the microchannel radiators with cylindrical,quadrangu-lar prism and triangular prism fins is 358 K,360 K and 364 K,and the temperature difference is 21.3 K,22.1 K,23.7 K,respectively.The results show that the cylindrical fin has the best comprehensive heat transfer performance.