针对2.5D封装用硅通孔(through silicon via,TSV)硅转接基板批量化生产过程中缺乏可靠性评价与优化技术的问题,提出基于统计过程控制(statistical process control,SPC)的评估控制系统,实现在线工艺状态监控及评价,设计硅转接板测试用工艺控制检测(process control monitor,PCM)结构,阐述自动光学检测(automated optical inspection,AOI)中常见的缺陷对系统可靠性的影响.提出的SPC系统对硅转接板批量化生产良率提升具有重要意义.
Silicon Interposer Yield Optimization System Based on Statistical Process Control
For the lack of reliability evaluation and optimization technology in the mass production process of through silicon via(TSV)silicon interposer for 2.5D packaging,an evaluation and control system based on statistical process control(SPC)is proposed.Online process status monitoring and evaluation are achieved.The process control monitor(PCM)structure for silicon interposer testing is designed.The influence of common defects in automated optical inspection(AOI)on system reliability is elaborated.The SPC system proposed is of great significance to improve the yield of silicon interposers in batch production.
silicon interposerstatistical process controlreliability evaluationprocess control monitorautomated optical inspection
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