首页|芯片测试环节质量重入随机系统建模与性能分析

芯片测试环节质量重入随机系统建模与性能分析

Modelling and analysis of semiconductor test system with quality re-entrance and stochastic characteristic

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芯片测试系统中,由于检测设备的不稳定性、产品价值昂贵等原因,产品检测过程中出现质量问题后经过一定调整重新进入检测,会形成质量重入问题.该类质量问题与系统的随机特性结合,使得系统的产出,周期等与系统参数呈现出复杂的非线性关系特性.本研究结合某芯片测试企业的实际问题,采用马尔科夫方法构建了模型,并获得系统的性能指标与参数之间的数值量化关系.阐述了方法的应用过程,进行了系统的性能评估和改善,为实际系统提出了质量管理、缓存设计、周期控制的相关建议.
In semiconductor test system, chips are inspected at the tester station. Because of the unsteady of the machines and some other technical issues with respect to products, the inspection results are not so reliable that the chips with quality issues will be treated and re-enter the testers. This phenomenon is defined as quality re-entrance which will influence the throughput and cycle time of the system dramatically. Besides that, the inspection times of the system are not constant but with some stochastic property. For these features, it's difficult to evaluate the system's performance. In this paper, we constructed a Markov model based upon the real semiconductor test system and obtained the throughput and cycle time performances. By the sensitivity analysis of the system, we studied the effects of the quality and the capacity limitation to the system performances and proposed some suggestions on system improvement.

semiconductor testquality re-entrancestochastic

李娜、江志斌、郑力、李杰

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上海交通大学工业工程系,上海200240

清华大学工业工程系,北京100084

唐山长城钢铁集团九江线材有限公司,唐山064400

芯片测试 质量重入性 随机系统

国家自然科学基金教育部高等学校博士学科点专项科研基金

7100203720100073120080

2011

系统工程理论与实践
中国系统工程学会

系统工程理论与实践

CSTPCDCSCD北大核心EI
影响因子:1.575
ISSN:1000-6788
年,卷(期):2011.31(8)
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