Research on the Variation of Device Thermal Resistance With Test Junction Temperature
In order to explore the changes in device junction temperature and thermal resistance during electrical thermal resistance testing of discrete semiconductor devices,experimental analysis based on thermal resistance testing was conried out.This paper provides a detailed introduction to the thermal resistance testing program and typical thermal resistance testing circuits,and conducts thermal resistance testing on four typical VDMOS devices.Based on the structural characteristics and thermal response curves of the devices,and through the relationship between phonon thermal conductivity and temperature in micro thermal conductivity theory,the variation law of device thermal resistance and junction temperature is analyzed,effectively ensuring the accuracy of junction temperature calculation for devices under aging and actual working conditions.