Design,progress and challenges of 3D carbon-based thermally conductive networks
The advent of the 5G era has stimulated the rapid development of high power electronics with dense integration.Three-dimensional(3D)thermally conductive networks,possessing high thermal and electrical conductivities and many different structures,are regarded as key materials to improve the performance of electronic devices.We provide a critical overview of carbon-based 3D thermally conductive networks,emphasizing their preparation-structure-property relationships and their applications in dif-ferent scenarios.A detailed discussion of the microscopic principles of thermal conductivity is provided,which is crucial for increas-ing it.This is followed by an in-depth account of the construction of 3D networks using different carbon materials,such as graphene,carbon foam,and carbon nanotubes.Techniques for the assembly of two-dimensional graphene into 3D networks and their effects on thermal conductivity are emphasized.Finally,the existing challenges and future prospects for 3D carbon-based thermally conductive networks are discussed.
Carbon material3D networkGrapheneThermal conductivityHeat transfer
国家科技期刊平台
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