基于三维异构集成技术的X波段4通道收发模组
X-band four-channel T/R module based on 3D integrated technology
李晓林 1高艳红 1赵宇 1许春良1
作者信息
- 1. 中国电子科技集团公司 第十三研究所,河北 石家庄市 050051
- 折叠
摘要
基于硅基微电子机械系统(MEMS)三维异构集成工艺,设计了一款适用于相控阵天线系统的三维堆叠4通道T/R模组.模组由3层功能芯片堆叠而成,3层功能芯片之间采用贯穿硅通孔(TSV)和球栅阵列实现电气互连;模组集成了6位数控移相、6位数控衰减、串转并、负压偏置和电源调制等功能,最终尺寸为12 mm×12 mm×3.8 mm.测试结果表明,在X波段内,模组的饱和发射输出功率为30 dBm,单通道发射增益可达27 dB,接收通道增益为23 dB,噪声系数小于1.65 dB.该模组性能优异,集成度高,适合批量生产.
Abstract
Based on silicon Micro-Electro Mechanical System(MEMS)technology,an X-band four-channel 3D integrated T/R module suitable for array antenna system is designed.The module is stacked by three layers of chips connected to each other by Through Silicon Via(TSV)and Ball Grid Array(BGA).The module integrates functions such as 6-bit digital control phase shifting,6-bit digital control attenuation and serial-to-parallel conversion,negative voltage bias,power modulation.The dimension of the module is 12 mm×12 mm×3.8 mm.The test results show that in the X-band,the saturated transmitting power of the single channel reaches 30 dBm,the gain of transmitting channel reaches 27 dB,the gain of receiving channel reaches 23 dB,the noise figure is less than 1.65 dB.The module bears excellent performance and high integration,which is suitable for mass production.
关键词
微系统/T/R模组/三维异构集成/微电子机械系统/硅通孔Key words
microsystem/T/R module/3D heterogeneous integration/Micro-Electro Mechanical System/Through Silicon Via引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据