Design of 3D heterogeneous film-based transceiver SiP module in X-band
A four-channel X-band chip transceiver System in a Package(SiP)module was realized by integrating multiple Monolithic Microwave Integrated Circuits(MMICs)and passive power division network into a very compact volume using silicon-based 3D heterogeneous integration technology.The module is Package on Package(PoP)stacked by two silicon-based packages,and the different packages are interconnected through the Ball Grid Array(BGA)mode.Chips are installed on the upper and lower surfaces of the inner cavity of a single package.The internal package is vertically interconnected using Through Silicon Via(TSV)and the module dimensions are 14 mm×14 mm×3.2 mm.The test results show that within 8～12 GHz,the transmission saturation output power of the module is≥30.5 dBm,the receiving gain is≥24.5 dB,the noise figure is≤3 dB,the receiving input P-1 is≥-26 dBm,and it also features 6-bit digital phase shifting and 6-bit digital attenuation capabilities,weighs approximately 1 g.It can be widely used in microwave transceiver system.
three-dimensional heterogeneous integrationPackage on Package stackhigh integrationfilm typeSystem in Package
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