X波段三维异构片式收发SiP模块设计
Design of 3D heterogeneous film-based transceiver SiP module in X-band
李晓林 1刘星 1高艳红 1赵宇 1许春良1
作者信息
- 1. 中国电子科技集团公司 第十三研究所,河北 石家庄 050051
- 折叠
摘要
采用硅基三维异构集成技术,在极小的体积内,将多个微波单片集成电路(MMIC)和无源功分网络一体化集成,实现了一种X波段4通道片式收发系统级封装(SiP).该SiP由2个体硅堆叠封装(PoP)而成,不同封装通过球栅阵列(BGA)方式互连,单层封装的内部腔体上下面均贴装芯片,封装内部采用硅通孔技术(TSV)实现垂直互连,SiP尺寸为14 mm×14 mm×3.2 mm.测试结果表明,在 8～12 GHz内,SIP 4 个通道的发射饱和输出功率≥30.5 dBm,接收增益≥24.5 dB,噪声系数≤3 dB,接收输入P-1≥-26 dBm,同时具备 6 位数控移相和 6 位数控衰减功能,重量约1 g,可广泛用于微波收发系统.
Abstract
A four-channel X-band chip transceiver System in a Package(SiP)module was realized by integrating multiple Monolithic Microwave Integrated Circuits(MMICs)and passive power division network into a very compact volume using silicon-based 3D heterogeneous integration technology.The module is Package on Package(PoP)stacked by two silicon-based packages,and the different packages are interconnected through the Ball Grid Array(BGA)mode.Chips are installed on the upper and lower surfaces of the inner cavity of a single package.The internal package is vertically interconnected using Through Silicon Via(TSV)and the module dimensions are 14 mm×14 mm×3.2 mm.The test results show that within 8～12 GHz,the transmission saturation output power of the module is≥30.5 dBm,the receiving gain is≥24.5 dB,the noise figure is≤3 dB,the receiving input P-1 is≥-26 dBm,and it also features 6-bit digital phase shifting and 6-bit digital attenuation capabilities,weighs approximately 1 g.It can be widely used in microwave transceiver system.
关键词
三维异构集成/堆叠封装/高集成/片式/系统级封装Key words
three-dimensional heterogeneous integration/Package on Package stack/high integration/film type/System in Package引用本文复制引用
出版年
2024
国家科技期刊平台
NSTL
万方数据