首页|Ni掺杂对β-Cu2Se薄膜微观结构和热电性能的影响

Ni掺杂对β-Cu2Se薄膜微观结构和热电性能的影响

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采用磁控溅射的方法和粉末真空烧结的Cu-Se合金靶材,使用高真空磁控溅射技术在单晶Si(100)衬底上制备掺杂Ni的β-Cu2Se热电薄膜.利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、电子探针和能谱仪(EDS)分别研究薄膜的相组成、表面和截面形貌、微区元素含量与分布.利用塞贝克(Seebeck)系数/电阻分析系统LSR-3测量沉积薄膜的Seebeck系数和电阻率,研究Ni含量对β-Cu2Se薄膜热电性能的影响.结果表明,使用烧结的Cu-Se合金靶材和利用磁控溅射技术可制备出仅有单一 β-Cu2Se相的薄膜,Ni掺杂没有改变β-Cu2Se相结构,而是在薄膜中形成替位式固溶体,沉积薄膜具有高度(111)晶面择优取向.在沉积的β-Cu2Se薄膜中,当Cu与Ni原子含量之和与Se原子含量比(([Cu]+[Ni])/[Se])大于2.0,具有p型导电特征.随Ni含量的增加,沉积β-Cu2Se薄膜的载流子浓度增加,而载流子迁移率下降.在所研究的温度范围内,掺杂Ni薄膜的电阻率和Seebeck系数均随着Ni掺杂量的增加而减小,并且都低于未掺杂薄膜.Ni掺杂量为1.80%(原子分数)的薄膜,因其电阻率和Seebeck系数适当,功率因子最大,高于未掺杂薄膜.掺杂适量Ni可有助于提高β-Cu2Se薄膜的功率因子.
Microstructure and Thermoelectric Properties of β-Cu2Se Films Doping with Ni
Cu2Se,which possesses the structure of phonon glass-electron crystal(PGEC),is an excellent thermoelectric material,which is not only due to the excellent thermal(ultra-low thermal conductivity)and electrical(low resistivity)transport properties,but also due to its unique properties such as environmental friendliness,low cost,low toxicity,rich in rare earth elements,high power fac-tor(PF)and high figure of merit(zT)values.In this work,Ni-doped β-Cu2Se thermoelectric films were prepared on high pure intrin-sic single Si(100)substrate with a thickness of 0.5 mm using vacuum powder-sintered Cu-Se alloy target by the high vacuum magne-tron sputtering.The crystalline structure,phase composition,element content and distribution,existence form and valence state of Cu,Se and Ni element,surface and cross-sectional morphology of the deposited films were studied and observed.The room tempera-ture carrier concentration(n)and carrier mobility(μ)were calculated by Hall experiments and the resistivity and Seebeck coefficient of the deposited Cu-Se thin films were measured.Results showed that the deposited Cu-Se thin films were composed of only a single β-Cu2Se phase,and β-Cu2Se films possessed a highly(111)referred orientation and the level of the(111)referred orientation of the films increased with increasing Ni content.The doping Ni substituted Cu in β-Cu2Se lattice in deposited thin films and a β-(Cu,Ni)2Se solid solution formed instead of forming metal Ni phase or Ni compound.The X-ray photoelectron spectroscopy(XPS)of Cu 2p and Se 3d proved Cu+and Se2-valence in deposited Ni-doped β-Cu2Se films.The binding energy of 853.35 and 870.61 eV of Ni 2p3/2 and Ni 2p1/2 proved NiSe bond or NiSe2 bond valence,namely Ni2+valence.This also indicated that Ni occupied the position of Cu atoms inβ-Cu2Se lattice and β-(Cu,Ni)2Se solid solution existed with no secondary phase.All deposited films showed a columnar grain growth along the direction perpendicular to substrate due to a large number of nuclei on substrate and poor diffusion ability of deposited atoms at lower temperature(not heating substrate).The columnar crystalline size became large along growth direction due to the aggregation and annexation of growth grain.The positive Hall coefficient and Seebeck coefficient indicated that the deposited Ni-doped β-Cu2Se films possessed p-type conductivity characteristics.The carrier concentration increased and mobility decreased with the increase of Ni content in deposited Ni-doped β-Cu2Se films,respectively.Ni,which is generally Ni2+,replace Cu+in β-Cu2Se lattice,providing more electrons that annihilate some of the holes generated by Cu+vacancy in lattice.The carrier concentration of the films decreased with in-creasing Ni contents.In the studied temperature range,the resistivity of the undoped Ni films exhibited a trend of first decreasing and then increasing with increasing measured temperature,with a turning change near 60 ℃.It was attributed to the transformation of a small amount of α-Cu2Se phase to β-Cu2Se phase.The resistivity of Ni-doped β-Cu2Se films monotonically increased with increasing measured temperature due to phonon scattering.In the whole measured temperature,the resistivity of Ni-doped β-Cu2Se films was low-er than that of the undoped films and the resistivity decreased with increasing the amount of Ni doping.Seebeck coefficients of all the films increased with increasing measured temperature.In the whole measured temperature,Seebeck coefficients of Ni-doped β-Cu2Se films were lower than those of undoped films and Seebeck coefficient decreased with increasing Ni doping.The power factor of all films increased with increasing measured temperature.The power factor showed a tendency of first increased and then decreased with in-creasing Ni content.The deposited thin film with 1.80%(atom fraction)doping Ni amount possessed the highest power factor due to its appropriate resistivity and Seebeck coefficient value,which was higher than that of the undoped deposited thin films.The power factor of β-Cu2Se film could be improved by an appropriate Ni doping amount.

thermoelectric materialsβ-Cu2Se thin filmNi dopingpreferred orientationSeebeck coefficient

王楠、宋贵宏、陈雨、李贵鹏、胡方、吴玉胜、杜昊

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沈阳工业大学材料科学与工程学院,辽宁沈阳 110870

广东腐蚀科学与技术创新研究院,广东广州 510530

热电材料 β-Cu2Se薄膜 Ni掺杂 择优取向 Seebeck系数

国家自然科学基金面上项目辽宁省"兴辽英才计划"项目

51772193XLYC2008014

2024

稀有金属
北京有色金属研究总院

稀有金属

CSTPCD北大核心
影响因子:1.483
ISSN:0258-7076
年,卷(期):2024.48(3)
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