预退火温度对半固态铜合金坯料组织演变和力学性能的影响
Influence of Pre-annealing Temperature on Microstructure Evolution and Mechanical Properties of Semi-solid Copper Alloy Billet
孙震 1崔鋆昕 1张雄超 1周瑀杭 1陈昊 1肖寒1
作者信息
- 1. 昆明理工大学材料科学与工程学院,云南 昆明 650093
- 折叠
摘要
将铸态CuSn10P1铜合金先预退火处理,随后采用冷轧等温处理应变诱导熔化激活法(CRITSIMA)制备成半固态坯料.采用金相显微镜、配置能谱仪的扫描电子显微镜、X射线衍射仪、电子探针和布氏硬度计,研究预退火温度对半固态铜合金坯料的组织演变及力学性能的影响.结果表明:随着预退火温度的升高,半固态铜合金坯料的平均晶粒尺寸增加,晶粒形状因子和液相率均降低;随着预退火温度升高,α-Cu相中固溶更多的Sn元素,减弱了 Sn元素偏析,晶间脆硬相δ相含量减少,布氏硬度逐渐减小.在半固态铜合金坯料中检测到新相Cu13.7Sn的存在,这与晶间Sn元素的高度偏析有关.600 ℃预退火2 h制备的半固态铜合金坯料显微组织晶粒均匀细小,力学性能较好,其平均晶粒尺寸为68.34 μm、晶粒形状因子为0.78,布氏硬度(HB)为1254.4 MPa.
Abstract
The as-cast CuSn10P1 copper alloy was pre-annealed and then prepared into semi-solid billets by cold rolling isothermal treatment strain-induced melting activation(CRITSIMA)method.The effects of pre-annealing temperature on the microstructure evolution and mechanical properties of semi-solid copper alloy billets were studied by OM,SEM,EDS,XRD,electron probe and Brinell hardness analyses.The results show that with increasing the pre-annealing temperature,the average grain size of the semi-solid copper alloy billet is increased,and the shape factor and liquid phase ratio are decreased.With increasing the pre-annealing temperature,Sn element content is increased in the solid solution ofα-Cu phase,segregation of Sn element is weakened,the content of intergranular brittle and hard phase δ is phase decreased,and the Brinell hardness is gradually decreased.The new phase Cu13.7Sn is detected in the semi-solid copper alloy billet,which is related to the high segregation of the intergranular Sn element.The semi-solid copper alloy billet prepared by pre-annealing at 600 ℃ for 2 h has fine and uniform microstructure and good mechanical properties.The average grain size is 68.34 μm,the shape factor is 0.78,and the Brinell hardness is 1254.4 MPa.
关键词
预退火温度/半固态铜合金/组织演变/元素偏析/硬度Key words
pre-annealing temperature/semi-solid copper alloy/microstructure evolution/element segregation/hardness引用本文复制引用
基金项目
国家自然科学基金(51965028)
云南省基础研究计划(202001AT070031)
出版年
2024