Ni改性GNSs对SnAgCuRE/Cu钎焊接头热老化特性的影响
Effect of Ni Modified GNSs on Thermal Aging Character-istics of SnAgCuRE/Cu Soldering Joints
王悔改 1张柯柯 1王冰莹 2王要利1
作者信息
- 1. 河南科技大学材料科学与工程学院,河南洛阳 471023;有色金属新材料与先进加工技术省部共建协同创新中心有色金属共性技术河南省协同创新中心,河南洛阳 471023
- 2. 河南科技大学材料科学与工程学院,河南洛阳 471023
- 折叠
摘要
以Sn2.5Ag0.7Cu0.1RE0.05Ni无铅钎料合金为研究对象,基于石墨烯纳米片(GNS)独特的结构、优异的物理性能和力学性能,以其为复合钎料的增强相,开展基于Ni改性GNSs(Ni-GNSs)增强SnAgCuRE系复合钎料/Cu的钎焊和钎焊接头热老化试验,探讨Ni-GNSs对复合钎料组织及钎焊接头热老化失效断裂机制的影响.结果表明:Ni-GNSs的加入,抑制了复合钎料的线膨胀,产生晶格畸变,导致位错产生,金属间化合物(IMC)颗粒分布在位错线附近,与位错发生交互作用,阻碍位错运动,强化复合钎料,进而强化复合钎料接头.随着热老化时间延长,钎焊接头界面IMC层厚度增加,剪切强度降低;其中,添加0.05％(质量分数)GNSs的复合钎料接头剪切强度降幅最小,为8.9％,且热老化384 h后,其剪切强度仍高于Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu合金接头热老化前的剪切强度.Ni-GNSs的加入,使复合钎料钎焊接头界面IMC的生长系数明显降低,有效缓解了复合钎料/Cu钎焊接头热老化过程中力学性能的降低,进而改变复合钎料/Cu钎焊接头的热老化失效断裂机制,最终影响接头的可靠性.Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu钎焊接头的断裂位置由热老化前的钎缝区向钎缝/界面IMC移动,变为韧脆混合断裂;而添加0.05％(质量分数)GNSs复合钎料接头的断裂位置均在钎缝区,为韧性断裂,钎焊接头可靠性较高.
Abstract
Sn2.5Ag0.7Cu0.1RE0.05Ni lead-free solder alloy was used as the research object.Based on the unique structure,excellent physical properties,and good mechanical properties of graphene nanosheets(GNSs),the Ni modified GNSs(Ni-GNSs)were used as the reinforcement phase.The soldering process of Ni-GNSs reinforced SnAgCuRE system composite solder/Cu and thermal aging tests of soldering joints were conducted to investigate the effect of Ni-GNSs on the microstructure and thermal aging fracture mechanism of composite soldering joints.Results show that the addition of Ni-GNSs inhibits the linear expansion of the composite solder,resulting in lattice distortion and dislocation.The intermetallic compound(IMC)particles near the dislocation line interact with the dislocations and hinder their movement,thereby strengthening the composite solder and further improving the soldering joint.With a longer thermal aging time,the thickness of interface IMC layer is increased and the shear strength of soldering joints is decreased.Among them,the shear strength decrement of the composite soldering joints with 0.05wt％GNS addition is the least of only 8.9％.Moreover,after thermal aging for 384 h,its shear strength is still higher than that of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joint before thermal aging.With the addition of Ni-GNSs,the growth coefficient of interface IMC of composite soldering joints is significantly reduced,which effectively alleviates the degradation of mechanical properties of composite solder/Cu soldering joints during the thermal aging process,further changes the thermal aging fracture mechanism of composite solder/Cu soldering joints,and ultimately affects the reliability of joints.The fracture position of the Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu soldering joints moves from the soldering seam before thermal aging to the soldering seam/interface IMC,presenting the ductile-brittle mixed fracture.The fracture position of the Sn2.5Ag0.7Cu0.1RE0.05Ni-0.05GNSs/Cu soldering joints is still in the soldering seam zone,presenting the ductile fracture,which indicates the high reliability of the soldering joints.
关键词
Ni-GNSs/SnAgCuRE系复合钎料/界面IMC/钎焊接头/热老化/组织与性能Key words
Ni-GNSs/SnAgCuRE system composite solder/interface IMC/soldering joints/thermal aging/microstructure and properties引用本文复制引用
基金项目
National Natural Science Foundation of China(U1604132)
Key Technology Research and Development Program of Henan Province(222102230114)
Major Scientific Research Foundation of Higher Education of Henan Province,China(23B430003)
出版年
2024
NETL
NSTL
万方数据