稀有金属材料与工程2024,Vol.53Issue(7) :1944-1952.DOI:10.12442/j.issn.1002-185X.20230344

Mg-Nd合金室温和深冷变形行为的研究

Deformation Behavior of Mg-Nd Alloy at Room Temperature and Cryogenic Temperature

陈豪 彭丽丽 李建冬 张静
稀有金属材料与工程2024,Vol.53Issue(7) :1944-1952.DOI:10.12442/j.issn.1002-185X.20230344

Mg-Nd合金室温和深冷变形行为的研究

Deformation Behavior of Mg-Nd Alloy at Room Temperature and Cryogenic Temperature

陈豪 1彭丽丽 1李建冬 1张静2
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作者信息

  • 1. 重庆大学材料科学与工程学院,重庆 400044
  • 2. 重庆大学材料科学与工程学院,重庆 400044;国家镁合金材料工程技术研究中心,重庆 400044
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摘要

采用准原位电子背散射衍射(EBSD)、滑移迹线法和晶内取向轴法(IGMA),研究了轧制退火态Mg-Nd合金板材在室温(RT)和-150 ℃深冷(CT)条件下沿轧制方向压缩过程中的变形行为.结果表明:变形温度不影响孪生模式,但会显著影响孪生形核率以及滑移模式.相比于RT压缩,经相同的压缩变形(4%),CT压缩显著增大了样品变形过程中的局部应力,导致孪晶形核率提高了约10%,孪晶界总长度提高了约8%,并促进了非基面滑移,其比例由RT压缩时的45.5%增加至CT压缩的65.9%,此外,低温抑制了压缩变形过程中的基面<a>滑移,其比例由RT压缩的54.5%降低至CT的34.1%.

Abstract

The compression deformation behavior of as-annealed Mg-Nd alloy sheet along rolling direction at room temperature(RT)and cryogenic temperature(CT)of-150 ℃ was investigated by in-situ electron backscattered diffraction(EBSD),slip trace method and in-grain misorientation axes(IGMA)method.The results show that the twinning mode is not affected by deformation temperature.In contrast,the twinning nucleation rate and slip type are dramatically affected.Compared with RT compression,the local stress is obviously increased in the sample under CT compression.As a result,the twinning nucleation rate and total length of twin boundary are increased by about 10%and 8%,respectively,at CT under the same compression deformation strain(4%).In the meantime,non-basal slips are promoted during CT compression deformation with the proportion increasing from 45.5%at RT to 65.9%at CT.In addition,the low temperature inhibits basal<a>slip during compression deformation,and the proportion of basal<a>slip is decreased from 54.5%at RT to 34.1%at CT.

关键词

变形温度/变形行为/EBSD/滑移迹线/IGMA

Key words

deformation temperature/deformation behavior/EBSD/slip trace/IGMA

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基金项目

重庆英才计划(51471038)

出版年

2024
稀有金属材料与工程
中国有色金属学会,中国材料研究学会,西北有色金属研究院

稀有金属材料与工程

CSTPCDCSCD北大核心
影响因子:0.634
ISSN:1002-185X
参考文献量26
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