稀有金属与硬质合金2024,Vol.52Issue(1) :63-68,80.DOI:10.19990/j.issn.1004-0536.2024.01.063.06

电镀参数对电沉积Sn-Ag-Cu合金镀层的影响

Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings

文思倩 闫焉服 周慧 程江洋
稀有金属与硬质合金2024,Vol.52Issue(1) :63-68,80.DOI:10.19990/j.issn.1004-0536.2024.01.063.06

电镀参数对电沉积Sn-Ag-Cu合金镀层的影响

Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings

文思倩 1闫焉服 1周慧 1程江洋1
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作者信息

  • 1. 河南科技大学材料科学与工程学院,河南洛阳 471023
  • 折叠

摘要

采用自主研发的甲磺酸锡银铜电镀液在黄铜基体上制备了Sn-Ag-Cu合金镀层.通过扫描电子显微镜(SEM)及其自带的能谱仪(EDS)分析了电镀工艺参数对Sn-Ag-Cu合金镀层的成分、表面形貌以及镀层厚度产生的影响.结果表明,当电流密度为4 A/dm2、温度为25 ℃及pH为5.5时,可获得结晶较细且致密,表面平整光亮且厚度均匀的Sn-Ag-Cu合金镀层.

Abstract

Sn-Ag-Cu alloy coating was prepared by using the self-developed Sn-Ag-Cu mesylate electropla-ting solution on brass substrate.The effects of electroplating process parameters on the composition,sur-face morphology,and thickness of Sn-Ag-Cu alloy coating were discussed by scanning electron microscope(SEM)and energy dispersive spectroscope(EDS).The results show that under the conditions of a current density of 4 A/dm2,a temperature of 25 ℃,and a pH of 5.5,the obtained Sn-Ag-Cu alloy coating has fine and dense crystals,smooth and bright surface,and uniform thickness.

关键词

Sn-Ag-Cu合金/电镀参数/甲磺酸锡银铜电镀液/表面形貌/镀层厚度/电流密度

Key words

Sn-Ag-Cu alloy/electroplating parameter/Sn-Ag-Cu mesylate electroplating solution/surface morphology/coating thickness/current density

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基金项目

国家自然科学基金项目(5117151)

河南省杰出青年基金资助项目(144100510002)

出版年

2024
稀有金属与硬质合金
中国有色金属学会,长沙有色冶金设计研究院有限公司

稀有金属与硬质合金

北大核心
影响因子:0.32
ISSN:1004-0536
参考文献量15
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