首页|电镀参数对电沉积Sn-Ag-Cu合金镀层的影响

电镀参数对电沉积Sn-Ag-Cu合金镀层的影响

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采用自主研发的甲磺酸锡银铜电镀液在黄铜基体上制备了Sn-Ag-Cu合金镀层.通过扫描电子显微镜(SEM)及其自带的能谱仪(EDS)分析了电镀工艺参数对Sn-Ag-Cu合金镀层的成分、表面形貌以及镀层厚度产生的影响.结果表明,当电流密度为4 A/dm2、温度为25 ℃及pH为5.5时,可获得结晶较细且致密,表面平整光亮且厚度均匀的Sn-Ag-Cu合金镀层.
Effect of Electroplating Parameters on Electrodeposited Sn-Ag-Cu Alloy Coatings
Sn-Ag-Cu alloy coating was prepared by using the self-developed Sn-Ag-Cu mesylate electropla-ting solution on brass substrate.The effects of electroplating process parameters on the composition,sur-face morphology,and thickness of Sn-Ag-Cu alloy coating were discussed by scanning electron microscope(SEM)and energy dispersive spectroscope(EDS).The results show that under the conditions of a current density of 4 A/dm2,a temperature of 25 ℃,and a pH of 5.5,the obtained Sn-Ag-Cu alloy coating has fine and dense crystals,smooth and bright surface,and uniform thickness.

Sn-Ag-Cu alloyelectroplating parameterSn-Ag-Cu mesylate electroplating solutionsurface morphologycoating thicknesscurrent density

文思倩、闫焉服、周慧、程江洋

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河南科技大学材料科学与工程学院,河南洛阳 471023

Sn-Ag-Cu合金 电镀参数 甲磺酸锡银铜电镀液 表面形貌 镀层厚度 电流密度

国家自然科学基金项目河南省杰出青年基金资助项目

5117151144100510002

2024

稀有金属与硬质合金
中国有色金属学会,长沙有色冶金设计研究院有限公司

稀有金属与硬质合金

北大核心
影响因子:0.32
ISSN:1004-0536
年,卷(期):2024.52(1)
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