首页|基于共晶焊技术的高温压力传感器无引线封装技术研究

基于共晶焊技术的高温压力传感器无引线封装技术研究

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针对MEMS高温压力传感器在高温特种环境下存在引线电学失效的不可靠性因素,制备了基于共晶焊技术的无引线封装SOI高温压阻式压力传感器.利用金锗合金焊料共晶焊接技术完成芯片与陶瓷基板的焊盘之间的连接.推力测试结果表明:其焊接强度最大值可达 28.30 MPa,均值约为26.47 MPa.完成 300℃环境下的老化后,其 300℃高温环境下零点漂移为 0.216%,时漂约为7.64 μV/h.老化后常温静态压力测试线性度为 0.126%,迟滞为 0.136%,重复性为 0.197%,均小于2‰,基本误差为0.433%.研究结果验证了金锗焊料共晶焊接制备无引线封装压力传感器的技术路线可行性.
Research on Leadless Packaging Technology of High Temperature Pressure Sensor Based on Eutectic Welding Technology
Aiming at the unreliability problem of MEMS high temperature pressure sensor with lead electrical failure in high temperature special environment,a leadless packaging SOI high temperature piezoresistive pressure sensor based on eutectic weld-ing technology was fabricated.The metal and germanium alloy solder eutectic welding technology was used to connect the ceramic substrate and the chip pad.The thrust test results show that the maximum welding thrust strength can reach 28.30 MPa,and the average is about 26.47 MPa.After the high temperature aging work at 300℃,the zero drift at 300℃is 0.216%,and the time drift is about 7.64 μV/h.After aging,the linearity of static pressure test at room temperature is 0.126%,the hysteresis is 0.136%,and the repeatability is 0.197%,all of which are less than two thousandths,and the basic error is 0.433%.The experi-mental results prove the feasibility of the technical route for fabricating leadless packaging pressure sensor by eutectic welding of gold-germanium solder.

micro electronic mechanical system(MEMS)eutecticleadless packaginghigh temperature pressure sensorbinary alloy

王宇峰、王丙寅、赵艳栋、雷程、梁庭

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中北大学,微纳器件与系统教育部重点实验室

内蒙古动力机械研究所

微机电系统(MEMS) 共晶 无引线封装 高温压力传感器 二元合金

国家重点研发计划项目中央引导地方科技发展资金项目山西省重点研发计划项目山西省重点研发计划项目山西省科技重大专项计划"揭榜挂帅"项目

2023YFB3209100YDZJSX20231B006202102030201001202102030201009202201030201004

2024

仪表技术与传感器
沈阳仪表科学研究院

仪表技术与传感器

CSTPCD北大核心
影响因子：0.585
ISSN：1002-1841
年,卷(期)：2024.(9)
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