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MgCuP热电性能研究

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以MgCuP材料为研究对象,通过实验和第一性原理计算研究材料的热电性能.实验研究表明:在温度为~600 K(~773 K)时材料的 Seebeck 系数 S 高达 165 µV/K(144μV/K),电导率 σ达 4.5 × 104 S/m(6.9 × 104 S/m),功率因子为 1200μW/(m·K2)(1430 μW/(m·K2)),远高于明星热电材料SnSe的功率因子(~1 000 μW/(m·K2)).理论计算表明:MgCuP的禁带宽度0.51 eV,价带出现重带和轻带重叠,导带出现两能谷的简并.理论和实验结果揭示MgCuP是一种理想的热电材料,其高Seebeck系数、电导率和功率因子来源于MgCuP材料合适的禁带宽度和价带/导带简并.
Study on the Thermoelectric Performance of MgCuP
The thermoelectric properties of MgCuP were studied through experiments and first principles calculations.Experi-mental studies imply that at~600(~773)K,the Seebeck coefficient S is 165(144)μV/K,electrical conductivity σreaches 4.5 x 104(6.9 x 104)S/m,and thus the power factor is as high as 1200(1430)μW/(m·K2),which is much better than that of typical thermoelectric material such as SnSe(PF=1000 μW(m·K2)).Theoretical calculations indicate that the bandgap of MgCuP is 0.51 eV,and heavy and light bands overlap in valence band and two energy valleys appear degeneracy in conduction band.Theo-retical and experimental results reveal that MgCuP is an ideal thermoelectric material,and its high Seebeck coefficients,conduc-tivities,and power factor are derived from the appropriate bandgap and valence/conduction band degeneracy or overlapping.

MgCuPthermoelectric transportfirst-principles calculation

杨军、杨明、卢清、李林

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宜宾学院数理学院,四川宜宾 644000

MgCuP 热电输运 第一性原理计算

国家自然科学基金项目国家自然科学基金项目宜宾学院校级教改重点项目宜宾学院大学生创新创业训练计划项目

1184712911904314156-JGZ202218X202310641340

2024

宜宾学院学报
宜宾学院

宜宾学院学报

CHSSCD
影响因子:0.185
ISSN:1671-5365
年,卷(期):2024.24(6)
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