基于陶瓷基板一体化封装的高可靠性LC滤波器组装工艺研究
Research on Assembly Process of High Reliability LC Filter with Ceramic Substrate Integrated Package
李亚飞 1温桎茹 1蒲志勇 1张钧翀 1张伟 1董姝 1吴秦1
作者信息
- 1. 中国电子科集团公司 第二十六研究所,重庆 400060
- 折叠
摘要
针对陶瓷基板一体化封装结构的LC滤波器,采用回流焊方法进行装配,制作了具有高可靠性的LC滤波器.采用电阻点焊对绕线电感进行引脚固定,使用贴片红胶粘接固定片式电容,实现陶瓷一体化封装LC滤波器内部元件的预固定.通过点涂方式施加焊膏,经回流焊接形成润湿良好的焊点,利用微压水柱清洗去除残留的助焊剂.经过调试和涂胶固定绕线电感后采用平行缝焊完成产品封装.对回流焊装配的LC滤波器进行过程检验、温度和机械试验.结果表明,由所研究的组装工艺制成的LC滤波器具有较好的工序直通率,满足高可靠环境应用要求,适合于批量化生产.
Abstract
The high reliability LC filters with ceramic substrate integrated package were fabricated by using the reflow soldering method.The resistance spot welding process was used to fix the pins of the winding inductor,and the chip capacitors were fixed by SMT red adhesive,thus the pre-fixation of the internal components in the ceramic substrate integrated packaging LC filter was achieved.The solder paste was added by coating and the well wetted welding spots were formed,the residual flux was removed and cleaned by using the micro-pressurized water col-umn.After debugging and glueing to fix the wound inductor,the parallel seam welding is used implement the prod-uct packaging.The process inspection,temperature and mechanical test of the LC filter fabricated by reflow solde-ring assembly were carried out.The results show that the LC filter fabricated by proposed assembly process have good process through rate,meet the requirements of high reliability environmental applications,and are suitable for mass production.
关键词
陶瓷基板/一体化封装/LC滤波器/回流焊接/可靠性Key words
ceramic substrate/integrated packaging/LC filter/reflow soldering/reliability引用本文复制引用
出版年
2024
NETL
NSTL
万方数据