一种应用于二次平行封焊的工艺方法
Process Method for Secondary Parallel Seal Welding
吉垚 1廖雯 1何玮洁 1唐坤龙 1王传瑶1
作者信息
- 1. 中国电子科技集团公司 第二十六研究所,重庆 400060
- 折叠
摘要
实现二次平行封焊并达到气密性标准是气密性产品返修的关键.该文介绍了一种应用于二次平行封焊的工艺方法,通过对平行封焊后的气密性元器件进行激光开盖,在控制多余物产生后,利用机加工铣平壳体围框表面进行二次平行封焊.测试并分析了气密性元器件系统集成封装(SIP)模块二次平行封焊后的检漏.结果表明,细检漏率＜1.01×10-8 Pa·m3/s,粗检漏无连续气泡产生,气密性满足电子与电器元件试验方法(GJB 360B-2009)要求.根据该文介绍的工艺方法可为多余物可控的气密性元器件实现二次平行封焊提供一种有效的解决方案.
Abstract
Achieving secondary parallel sealing and meeting airtightness standards have become key to repairing airtight products.To solve this issue,this paper introduces a process method applied to secondary parallel seal welding.By laser uncapping the hermetically sealed components after parallel seal welding and controlling the gener-ation of wast ematerial,the surface of the shell enclosure is milled flat using machining.Finally,the secondary par-allel seal is welded.The airtight-component system integration packaging(SIP)module is tested and analyzed to detect leaks after the secondary parallel seal welding.The leakage rate of less than 1.01×10-8 Pa·m3/s for the fine-leakage detection meets the requirements of electronic and electrical component test methods(GJB.360B-2009).There is no continuous bubble generation for rough leakage detection.Therefore,the process introduced in this paper can provide an effective solution for secondary parallel sealing airtight components with controllable waste material.
关键词
气密性封盖/平行封焊/返修/检漏Key words
hermetically sealed closure/parallel seal welding/repair/leakage detection引用本文复制引用
出版年
2024
NETL
NSTL
万方数据