首页|背腔刻蚀型横向激励薄膜体声波谐振器制备技术研究

背腔刻蚀型横向激励薄膜体声波谐振器制备技术研究

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随着移动通信技术的快速发展,薄膜体声波滤波器逐渐向高频和大带宽方向发展.该文研究了POI(LiNbO3/SiO2/Si)基片上背腔刻蚀型横向激励薄膜体声波谐振器制作工艺,通过研究POI基IDT光刻、背腔硅刻蚀等工艺,确定了IDT层曝光量和背腔刻蚀等关键工艺参数.研制出的背腔刻蚀型横向激励薄膜体声波谐振器,其谐振频率为4 565 MHz,反谐振频率为5 035 MHz,机电耦合系数为20.86%.此制备工艺对研究高频、大带宽薄膜体声波滤波器具有重要的参考意义.
The Study of Based on Back Cavity Etching and Lateral Exciting Film Bulk Acoustic Resonator
With rapid development in mobile technology,film bulk acoustic resonators have developed in a high frequency and wide bandwidth direction.This study focuses on the technological process of back cavity etching and a lateral exciting film bulk acoustic resonator on the POI(LiNbO3/SiO2/Si).On the study of the IDT optical lithogra-phy,etching and back cavity corrosion,the critical process parameters are determined.The frequency response curve shows that resonance and antiresonance frequencies were 4 565 and 5 035 MHz,respectively.The effective electro-mechanical coupling coefficient was 20.86%,which is significant for research on high frequency and wide bandwidth film bulk acoustic resonators.

dry etchetch ratelateral excitingelectromechanical coupling coefficientfilm bulk acoustic re-sonator

徐阳、司美菊、吴高米、刘文怡、巩乐乐、甄静怡、余奇、陈金琳

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中国电子科技集团公司第二十六研究所,重庆 400060

国知创芯(重庆)科技有限公司,重庆 401332

中电科芯片技术(集团)有限公司,重庆 401332

干法刻蚀 刻蚀速率 横向激励 机电耦合系数 薄膜体声波谐振器

2024

压电与声光
四川压电与声光技术研究所

压电与声光

CSTPCD北大核心
影响因子:0.357
ISSN:1004-2474
年,卷(期):2024.46(3)
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