Research on Au-Sn Bonding for Wafer-Level Packaging of FBAR Filters
As a passive,small-sized,and high-power-tolerant device,the film bulk acoustic resonator(FBAR)has been widely used in radio frequency signal processing.Wafer-level hermetic packaging represents miniaturized packaging and plays a critical role in various high-reliability applications.Both gold-gold and gold-tin bonding are widely used in FBAR hermetic wafer-level packaging.However,gold-tin bonding has a more straight forward imple-mentation process.Therefore,this study investigates the application of gold-tin bonding in hermetic wafer-level packaging.Under the condition of ensuring bonding strength,3 GHz filter samples were produced.The experimental results demonstrated identical perfomances with all samples passing the reliability tests.
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