乳化工艺对无铅焊锡膏性能的影响
Effect of Emulsification Process on the Properties of Lead-free solder Paste
熊晓娇 1武信 1柳丽敏 1何欢 1钱斌 1何禹浩 1张文正1
作者信息
- 1. 云南锡业新材料有限公司, 云南 昆明 650501
- 折叠
摘要
研究了乳化工艺温度对无铅焊锡膏性能的影响.制备出8 组对应乳化工艺的助焊膏,将助焊膏经相同碾磨工艺碾磨后,分别与Sn96.5Ag3.0Cu0.5 合金焊锡粉混合搅拌,制备出焊锡膏,对助焊膏粒度、焊锡膏状态、焊锡膏润湿性和耐干性进行测试.结果表明:升高乳化温度和降低结束温度制备的助焊膏粒度显著变小;焊锡膏的状态和耐干性随乳化温度的升高和结束温度的降低得到明显改善,在允许范围内(95～110℃),乳化温度越高,焊锡膏整体性能越好;结束温度为50℃时效果最佳.
Abstract
The effect of emulsification process temperature on the properties of lead-free solder paste was studied.Eight groups of flux pastes cor-responding to the emulsification process were prepared,and the solder paste was prepared by mixing and stirring with Sn96.5Ag3.0Cu0.5 alloy solder powder after grinding with the same grinding process,and the particle size,solder paste state,wettability and drying resistance of the solder paste were tested.The results showed that the particle size of the flux paste prepared by increasing the emulsification temperature and decreasing the end temperature was significantly smaller.The state and drying resistance of the solder paste were significantly improved with the increase of emulsification temperature and the decrease of end temperature,and it was concluded that the higher the emulsion temperature(95℃-110℃),the higher the emulsion temperature,the better the overall performance of the solder paste;The results are best at an end temperature of 50℃.
关键词
无铅焊锡膏/助焊膏/乳化工艺/碾磨/润湿性/耐干性Key words
lead-free solder paste/flux paste/emulsification process/milling/wettability/dry resistance引用本文复制引用
基金项目
云南省科技重大专项(202302AB080013)
出版年
2024
国家科技期刊平台
NSTL
万方数据