Effect of Emulsification Process on the Properties of Lead-free solder Paste
The effect of emulsification process temperature on the properties of lead-free solder paste was studied.Eight groups of flux pastes cor-responding to the emulsification process were prepared,and the solder paste was prepared by mixing and stirring with Sn96.5Ag3.0Cu0.5 alloy solder powder after grinding with the same grinding process,and the particle size,solder paste state,wettability and drying resistance of the solder paste were tested.The results showed that the particle size of the flux paste prepared by increasing the emulsification temperature and decreasing the end temperature was significantly smaller.The state and drying resistance of the solder paste were significantly improved with the increase of emulsification temperature and the decrease of end temperature,and it was concluded that the higher the emulsion temperature(95℃-110℃),the higher the emulsion temperature,the better the overall performance of the solder paste;The results are best at an end temperature of 50℃.
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