以低温无铅互连中SnBi58 无铅钎料合金为基础,研究了不同 Cu 含量下合金的力学性能、熔化特性、可焊性、铺展率、微观组织,以及静态焊接界面与时效界面的微观组织.结果表明:适当添加 Cu,可以细化合金组织,提升合金性能;当Cu添加量在0.4%～0.8%时,综合性能表现最优.
Effect of Copper Content on the Properties of SnBi58 Alloy
Based on SnBi58 lead-free solder alloy for low temperature lead-free interconnection,the mechanical properties,melting character-istics,weldability,spreading rate,microstructure and microstructure of static welding interface and aging interface of the alloy with different Cu content were studied.The results show that proper Cu addition can refine the microstructure and improve the properties of the alloy.When the content of Cu is between 0.4%and 0.8%,the comprehensive properties are better.
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