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高速PCB传输线信号完整性设计要点研究

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为了解决高密度、集成化高速PCB中传输线因走线空间有限,走线设计不当所带来的信号完整性问题,采用理论分析、经验值设计、仿真分析的手段对8层高速PCB设计进行研究.分析高速PCB走线设计对传输线反射、串扰等信号完整性问题的影响.在PCB布线完成后,通过SI-wave软件仿真对PCB传输线线宽、线间距和阻抗值大小对信号完整性的影响进行研究,验证设计经验值3 W间距和50 Ω阻抗的可靠性.指导PCB信号走线设计,达到信号的完整性,以期为实际工程实践应用提供参考和借鉴.
Research on signal integrity design of high-speed PCB transmission line
In order to solve the signal integrity problem caused by the limited routing space and improper routing design of transmission lines in high density and integrated high speed PCB,the design of 8-layer high speed PCB was studied by means of theoretical analysis,empirical design and simulation analysis.The influence of high-speed PCB routing design on signal integrity such as transmission line reflection and crosstalk is analyzed.After the com-pletion of PCB wiring,the influence of PCB transmission line width,line spacing and impedance value on signal in-tegrity was studied by SIwave software simulation,and the reliability of the design experience value of 3 W spacing and 50 Ω impedance was verified.Guide PCB signal routing design to achieve signal integrity,so as to provide refer-ence for practical engineering application.

signal integritytransmission linecrosstalkreflectionPCB design

陈世强、刘明、姚三坤、耿腾飞

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云南民族大学电气信息工程学院,云南昆明 650500

信号完整性 传输线 串扰 反射 PCB设计

国家自然科学基金

52061042

2024

云南民族大学学报(自然科学版)
云南民族大学

云南民族大学学报(自然科学版)

CSTPCD
影响因子:0.381
ISSN:1672-8513
年,卷(期):2024.33(3)
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