球珊阵列(BGA)封装的芯片植球过程影响性分析
Analysis of Influence of Ball Planting Process on Chip Packaged with BGA
陈雨柔 1曹德 1杨宇通 1何若华 1王东1
作者信息
- 1. 陕西省西安市航空工业集团公司西安航空工业计算技术研究所,陕西西安 710000
- 折叠
摘要
球珊阵列封装(BGA封装)是将裸芯片安装在不同材料的多层基板载体顶部表面形成的,根据基板材料的不同主要分为塑封BGA(PBGA)和陶瓷BGA(CBGA).本文主要就这两种封装类型,研究植球过程对BGA封装器件本体的影响.
Abstract
Ball Grid Array(BGA)packaging involves the placement of bare chips on the top surface of multi-layer substrate carriers made of various materials.Depending on the substrate material,it is primarily classified into Plastic Ball Grid Array(PBGA)and Ceramic Ball Grid Array(CBGA).This article primarily focuses on studying the impact of the ball placement process on the BGA packaging device itself,with a particular emphasis on these two packaging types.
关键词
BGA/植球/焊接/封装Key words
BGA/ball placement/soldering/packaging引用本文复制引用
出版年
2024
NETL
NSTL
万方数据