Analysis of Influence of Ball Planting Process on Chip Packaged with BGA
Ball Grid Array(BGA)packaging involves the placement of bare chips on the top surface of multi-layer substrate carriers made of various materials.Depending on the substrate material,it is primarily classified into Plastic Ball Grid Array(PBGA)and Ceramic Ball Grid Array(CBGA).This article primarily focuses on studying the impact of the ball placement process on the BGA packaging device itself,with a particular emphasis on these two packaging types.
NETL
NSTL
万方数据
