Effect of Solid Solution and Aging Treatment on Microstructure and Properties of Cu-Ti Alloys Prepared by Aluminothermic Reaction
As a preparation material for important components such as conductive springs and interconnect connectors,the large-scale industrial preparation method and heat treatment process of Cu-Ti alloy are still the key areas that urgently need to be developed and promoted in the current copper alloy field.In the present paper,Cu-Ti alloys with Ti content of 1％,4.5％and 10％were prepared by aluminothermic reaction,which has the advantages of simple process,environmental protection,energy saving and low cost,and the comprehensive properties of the alloys were further regulated by solid solution and aging treatment.The results show that the Ti elements in the aged Cu-1％Ti and Cu-4.5％Ti alloys are mainly in the state of solid solution with only a small amount of smaller precipitates,while there are a large amount of precipitates in the aged Cu-10％Ti alloys.With the increase of Ti content,the electrical conductivity of the alloys shows a significant decrease trend,while the hardness and strength show the opposite trend.For the alloys with the same composition,compared to the solid solution state,the conductivity first slightly decreases and then increases with aging time.After aging at 450 ℃ for 4 h,the conductivity of all three component alloys is higher than that of the solid solution state alloys.After aging at 450 ℃ for 2 h,the hardness,strength and elongation of Cu-1％Ti and Cu-4.5％Ti alloys obtain the maximum values,and the hardness and elongation of Cu-10％Ti alloys also obtain the maximum values,while the yield and the tensile strength of Cu-10％Ti alloys show slightly decreasing trend with aging time.
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