Effect of Ag3Sn Nanoparticles on the Morphology and Thickness of Solder Intermetallic Compounds
In this study,Ag3Sn nanoparticles were synthesized using the redox method and incorporated into SAC305 solder at varying mass ratios(0,0.1％,0.15％,0.2％)to investigate their impact on the microstructure,wettability,and reliability of the solder.The physical phase and morphology of the Ag3Sn nanoparticles were characterized by X-ray diffractometer and scanning electron microscope,while the microstructure of the solder joints was observed using a metallographic microscope.Subsequently,the solder joints were aged at 150 ℃ for different durations(0,50,100,150,200 h),and the interfacial intermetallic compound(IMC)layer thickness was measured using Image J software to calculate the growth coefficient.Results indicate that the addition of an appropriate amount of Ag3Sn nanoparticles to SAC305 solder enhances wettability,refines the microstructure,and inhibits IMC layer growth.As aging progresses,the Cu6Sn5 intermetallic compound layer transitions from scalloped to planar,accompanied by the appearance of the Cu3Sn intermetallic compound layer.The optimal performance was observed with the addition of 0.15 wt.％Ag3Sn nanoparticles to SAC305 solder,resulting in improved wettability(spreading area of 167.447 mm2),minimal growth coefficient(0.04),and enhanced microstructural refinement.
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