首页|TZM钼合金箔材退火行为研究

TZM钼合金箔材退火行为研究

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TZM钼合金具有比纯钼更优异的力学性能和更高的再结晶温度,适用于更广泛的应用场景,TZM箔材可以替代纯钼箔材应用于电子等领域.通过研究TZM箔材经过不同退火温度和高温短时退火热处理的显微组织和力学性能,发现900 ℃的退火可以使箔材完成去应力,并出现最大延伸率;高温短时退火提升了材料的抗拉强度,2次高温短时退火后箔材具有最大强度和较高的延伸率;杯突测试显示出与力学性能类似的规律,900 ℃退火使材料具有最大杯突值3 mm,经过2次高温短时退火后杯突值提高 23%.
Effect of Annealing on the Properties of TZM Molybdenum Alloy Foil
TZM molybdenum alloy shows superior mechanical properties and higher recrystallization temperature than pure molybdenum,making it suitable for a wider range of application scenarios.TZM foil can replace pure molybdenum foil in electronic and other fields.The microstructure and mechanical properties of TZM foil after different annealing temperatures and high-temperature short-term annealing heat treatment was studied in this paper.It is found that annealing at 900℃ can achieve stress relief and maximum elongation of the foil;High temperature short-term annealing enhances the tensile strength of the material,and after two times high-temperature short-term annealing,the foil exhibits maximum strength and higher elongation;The cupping test similar to mechanical properties,annealing at 900℃ resulted in a maximum cupping value of 3 mm for the material.After two times high-temperature short-term annealing,the cupping value increased by 23%.

molybdenum alloyheat treatmentmicrostructuremechanical propertiescup test

唐作章、王广达、熊宁、孙迪

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安泰天龙钨钼科技有限公司,天津 301800

安泰科技股份有限公司,北京 100094

钼合金 热处理 显微组织 力学性能 杯突

天津市科技计划

24ZYJDSS00230

2024

有色金属工程
北京矿冶研究总院

有色金属工程

CSTPCD北大核心
影响因子:0.432
ISSN:2095-1744
年,卷(期):2024.14(10)