高纯溅射靶材回收研究现状
Research status of recovery of high-purity sputtering targets
仝连海 1钟伟攀 1李凤连2
作者信息
- 1. 上海同创普润新材料有限公司,上海 201306;同创普润(上海)机电高科技有限公司,上海 201400
- 2. 上海江丰电子材料有限公司,上海 201306
- 折叠
摘要
高纯溅射靶材在晶圆代工企业和液晶面板企业作为耗材使用.高纯溅射靶材利用率低,一般平面靶利用率低于30%,旋转靶难超过70%,回收溅射后的残靶具有非常高的经济价值和环保意义.本文综述了贵金属、ITO、钛、钽、铝、铜等高纯靶材的回收研究现状,总结了靶材回收过程中面临的共同问题.目前在高纯靶材的残靶回收中还存在金属回收率低、回收的纯度不高、工艺流程长等问题需要攻克和改善,作者展望了开发较短的流程、环境友好的工艺、探索高价值的用途,是未来高纯残靶回收技术改进和发展的方向.
Abstract
High purity sputtering targets are used as consumables in wafer foundries and LCD panel companies.The utilization rate of high purity sputtering target is low.The utilization rate of general flat targets is less than 30%,and it is difficult for rotating targets to exceed 70%.It is of great economic value and environmental significance to recycle the sputtered residual target.The research status of recovery of high purity target materials such as precious metals,ITO,titanium,tantalum,aluminum and copper were reviewed,and common problems in the recovery process of target materials were summarized.At present,there are still problems that need to be overcome and improved in the residual target recovery of high-purity target materials,such as low metal recovery rate,low purity of recovery,and long process flow,so the author anticipates that developing shorter process,environment-friendly process and exploring high-value uses are the directions for the improvement and development of high-purity residual target recycling and reuse technology in the future.
关键词
溅射靶材/残靶回收/贵金属/氧化铟锡/高纯金属/芯片/显示器/集成电路Key words
sputtering target/target material recycling/precious metal/indium tin oxide/high-purity metal/chip/display device/integrated circuit引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据