中国有色冶金2024,Vol.53Issue(2) :63-68.DOI:10.19612/j.cnki.cn11-5066/tf.2024.02.008

添加剂对5 μm电解铜箔性能及形貌的影响

Effect of additives on the performance and morphology of 5 μm electrolytic copper foil

樊斌锋 韩田莉 王庆福 彭肖林 裴晓哲
中国有色冶金2024,Vol.53Issue(2) :63-68.DOI:10.19612/j.cnki.cn11-5066/tf.2024.02.008

添加剂对5 μm电解铜箔性能及形貌的影响

Effect of additives on the performance and morphology of 5 μm electrolytic copper foil

樊斌锋 1韩田莉 1王庆福 1彭肖林 1裴晓哲1
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作者信息

  • 1. 河南高精铜箔产业技术研究院有限公司,河南灵宝 472500
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摘要

电解铜箔因其具有强度高、延展性良好等优势被广泛应用于新能源领域,目前对于5 µm电解铜箔性能的影响因素研究较少.本文采用单一变量法考察了 PEG、HVP和HP等添加剂对Cu电沉积的影响,通过正交试验探究PEG、HVP和HP复合添加剂对5 µm电解铜箔性能的影响,并对比了不同添加剂对5 µm电解铜箔外观形貌的影响,得到如下结论:PEG和HVP具有增强极化的作用,且随着浓度的增加极化作用增强,HP具有去极化的作用,且随着浓度的增加去极化作用增强;通过正交试验得出的最优复合添加剂的浓度为PEG 0.36g/L、HVP 0.12 g/L、HP0.05 g/L,在此条件下得到的较佳性能为抗拉强度485.17 MPa、延伸率3.72%、粗糙度1.31;相比于单一添加剂,最优配比复合添加剂下的复合镀层表面更加均匀平整,且颗粒细小.

Abstract

Electrolytic copper foil has been widely used in the field of new energy because of its advantages of high strength and good ductility.At present,there are few studies on the factors affecting the performance of 5 μm electrolytic copper foil.In this paper,the effects of PEG,HVP,HP and other additives on Cu electrodeposition were investigated by single variable method.The effects of PEG,HVP and HP compound additives on the performance of 5 μm electrolytic copper foil were investigated by orthogonal test,and the effects of different additives on the appearance of 5 μm electrolytic copper foil were compared.The following conclusions were reached:PEG and HVP can enhance the polarization,and the polarization increases with the increase of the concentration.HP can depolarization,and the depolarization increases with the increase of the concentration.The optimal concentration of the compound additive was PEG 0.36 g/L,HVP 0.12 g/L and HP 0.05 g/L,and the best properties were tensile strength 485.17 MPa,elongation 3.72%and roughness 1.31.Compared with a single additive,the surface of the composite coating under the optimal ratio of composite additive is more uniform and smooth,and the particles are fine.

关键词

5/µm电解铜箔/铜沉积/复合添加剂/聚乙二醇(PEG)/水解蛋白(HVP)/醇硫基丙烷磺酸钠(HP)/铜箔性能/微观形貌

Key words

5 μm electrolytic copper foil/copper deposition/compound additive/polyethylene glycol(PEG)/hydrolyzed protein(HVP)/sodium thiopropanesulfonate(HP)/copper foil performance/micromorphology

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出版年

2024
中国有色冶金
中国有色工程有限公司

中国有色冶金

北大核心
影响因子:0.369
ISSN:1672-6103
参考文献量22
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