Wafer dicing is the most widely used process in the semiconductor industry,which a-chieves the monomer formation of chips.Electroplating dicing blade is one of the commonly used tools for wafer scoring,which is generally composed of metallic nickel and diamond abrasives.The amount of abrasive deposited during the electroplating process directly affects the perform-ance and service life of the blade,so the amount of diamond abrasives embedded during electro-plating must be strictly controlled during the blade manufacturing process.As the abrasive parti-cle size decreases,the difficulty of electro-embedding of abrasives increases.This article discus-ses the effects of particle size,morphology,and impurity content of diamond abrasives on the a-mount and dispersion of electro-embedding abrasives.The experiment has shown that the parti-cle size of abrasives has a significant impact on the amount of abrasives embedded,the content of internal and external impurities in abrasives also has an impact on electro-embedding abrasives,but it has no significant effect on the dispersibility of the coating abrasives.The morphology of abrasives has little effect on the concentration and dispersion of electro-embedding abrasives.
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