钨粉粒径对金刚石扩散镀钨影响的研究
Study on the effect of tungsten powder particle size on diffusion plated tungsten on diamond surface
赵龙 1袁春琪 1马浩 1涂于飞1
作者信息
- 1. 郑州西亚斯学院,电信与智能制造学院,河南郑州 451100
- 折叠
摘要
金刚石镀钨能够改善铜与金刚石的润湿性,有助于合成金刚石/铜复合材料.采用扩散烧结法对金刚石表面进行处理,研究钨粉粒径对镀层的影响.并对试验机理及规模化生产的可行性进行了论述.试验结果表明:钨粉粒径过小或过大时均镀覆失败,其最佳镀覆粒径为金刚石粒径的1/3～2/3;金刚石烧结量对镀层影响关系很小,真空扩散镀钨烧结法适用于工业批量生产.
Abstract
Plated tungsten on the diamond surface can improve the wettability between copper and diamond,which is helpful for the synthesis of diamond copper composite.The surface of diamond was treated by diffusion-sintering method,and the effect of tungsten particle size on the coating was studied.The experimental mechanism and the feasibility of scale production were discussed.The results show that,the plating was a failure when the particle size of tungsten powder is too large or too small,and the optimal particle size of tungsten for plating is 1/3～2/3 of the diamond particle size.The effect of the amount of sintered diamond on the coating is very small,and the vacuum diffusion-sintering method is suitable for industrial batch production.
关键词
扩散烧结法/金刚石铜复合材料/钨粉/粒径/镀层Key words
Diffusion sintering method/Diamond copper composites/Tungsten powder/Particle size/Coating引用本文复制引用
出版年
2024
NETL
NSTL
万方数据